Toshiba and SanDisk have unveiled the first 256Gb 48 layer BiCS 3D flash memory. How is this connected to Apple? Both these companies are the two major flash providers for Apple’s iPhone 6. With this announcement, reports suggest, that the iPhone 7 which is expected to launch next year, could come with this hardware.

This means that with these 32GB flash modules the iPhone 7 would be potentially, faster and more efficient than anything else in the market. Reports also say that the new chip is-built on a 15nm process technology and will have twice the capacity of the most compact memory available in the markets today.

This new product can be used in smartphones, tablets, memory vards, SSDs etc. It is based on the 3D Bit Cost Scaling technology which enhances the write or erase reliability and can boost write speeds as compared to a 2D memory. It is also said to be able to store 3 bits of data per transistor.

However, neither Toshiba nor Apple have confirmed anything. The hardware company has not mentioned any potential clients for this product, although reports assume that Apple might stick to its usual suppliers and hence incorporate the new type of 3D NAND flash in their new device next year.

Toshiba has said that they will be sampling the new flash memory in September and announced that they are preparing for mass production of the device. This collaboration between SanDisk and Toshiba is said to be completed next year.

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